X-LIGHT 신터링 시스템

(X-LIGHT SINTERING SYSTEM) 

• All materials have basic properties

• Melting point, light absorption (color) etc.
• Governed by laws of particle physics
• These are independent of particle size
• Melting point for a gram of copper is the same as for a kg of Copper.  It still looks like the same material

Once materials become around the size of 1 to 100 nanometers  quantum physics becomes significant
• Their Melting point changes
• Optical absorption characteristics change: Quantum Dots
• Opens up new possibility of sintering at significantly lower  temperature when compared to bulk material.
• Gold 1064 C bulk 300 C when 25nm 

 

• Basic Principle

• Start with nanoparticle conductive ink
• Deposit on substrate
• Use low temperature to achieve sinter
• Convert to Bulk conductive material,
• nanoparticle properties change
• Melting point, color etc.
• Two different categories of conductive nano inks
• Basic Sintering –e.g. Silver
• Reduction and Sintering –e.g. Copper
• Why Sinter Conductive Inks
• Melting point of metals are usually higher than plastics (the substrate)
• Would make conductive traces (printed circuits) onflexible materials
• Could be applied by regular printing process like  roll to roll or inkjet.

• Silver is relatively easy to sinter
• Silver is Conductive as is Silver Oxide
• Nanomaterial is easy(er) to produce
• Yield is high even if bulk is expensive
• Energy required is low nanoparticle size 5-
• Traditional process.
• Use 120 C thermal for around 10 minutes.
• Shiny finish good conductivity.
• Using X-Light Lamp
• Excellent Conductivity
• Matt finish due to rapid formation

Copper Is harder to sinter

• Copper is conductive, Copper oxide not a good conductor. Copper readily oxidizes
• Nanomaterials are harder to produce
• Yield is low even if bulk is cheaper
• Energy required is significantly higher
• Is the “Holy Grail” for Printed electronics technology
• Typically Sintering also requires a reduction of copper oxide to copper.
• Some Oxidizing material in the ink may be required
• Small margin between energy to sinter and energy to evaporate material

• In addition to low temperature curing, there are additional benefits of X-Light curing that make it suitable for printable electronics.
• By reducing the time to cure milliseconds, X-Light curing can be compatible with high-speed printing processes such as gravure and flexography without a large amount of dedicated floor space. In essence, the time to cure becomes matched to the time to print.
• The process is suited to nanoparticle-based materials, which also makes it well-suited to high resolution deposition methods and applications.
• The speed with which sintering occurs makes it possible to cure copper in air, which normally must be cured in an inert or reducing environment.
• Once a material has been sintered, it will typically no longer absorb light. Thus there is the potential for building multilayer circuitry that does not thermally stress the underlying layers.

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